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Mechanoluminescent (ML) materials are used for fabricating sensors and other devices such as artificial skin, colorful displays, and energy harvesting devices. However, a key challenge in developing ML-based sensors is the ability to effectively capture and efficiently transmit ML light from the sensing location. Here we report a flexible and sensitive thin film pressure sensor, created using a novel combination of ML material and perovskite. In this work, we adopted a simple lateral type design of a thin pressure sensor primarily consisting of (i) a sensing layer of copper-doped zinc sulfide (ZnS:Cu)/polydimethylsiloxane (PDMS) composite and (ii) a light absorbing layer of perovskite. The mixed halide perovskite, a light absorbing material, fully absorbs the green light emitted from ZnS:Cu. The sensor demonstrated consistent signal output under the mechanical bending test. A thin encapsulation layer of PMMA on the perovskite layer prevents moisture inclusion. This innovative technique of utilizing integrated thin perovskite to efficiently harvest ML light has the potential to open up new avenues for advanced research in ML-perovskite-based sensor systems. 

Recent developments in sensing technologies have triggered a lot of research interest in exploring novel self-powered, inexpensive, compact and flexible pressure sensors with the potential for structural health monitoring (SHM) applications. Herein, we assessed the performance of an embedded mechanoluminescent (ML) and perovskite pressure sensor that integrates the physical principles of mechanoluminescence and perovskite materials. For a continuous in-situ SHM, it is crucial to evaluate the capabilities of the sensing device when embedded into a composite structure. An experimental study of how the sensor is affected by the embedment process into a glass fiber-reinforced composite has been conducted. A series of devices with and without ML were embedded within a composite laminate, and the signal responses were collected under different conditions. We also demonstrated a successful encapsulation process in order for the device to withstand the composite manufacturing conditions. The results show that the sensor exhibits distinct signals when subjected to different load conditions and can be used for the in-situ SHM of advanced composite structures.